副教授

从2016年开始承担本科生教学工作，本科生班主任，暑期实习优秀带队教师。《航空航天材料概论》（williamhill官方网站主页2019年“课程思政”示范课程）、《无机材料工艺及合成实验》主讲教师，《生产实习》带队教师。

（1）研究领域

1. 电力电子封装材料与可靠性、三维封装微细焊点制造原理与技术、基于TEM/EBSD的界面结构与性能表征等；2. 纳米金属浆料制备与应用、基于喷墨打印与丝网印刷的可穿戴柔性传感器的制造；3.液态金属与自修复电路、先驱体陶瓷压力传感器材料与制造等。

（2）承担科研项目

主持或参与包括科技部、基金委等各类科研基金项目20余项，主持科研经费累积240余万元。

1. 深圳市自然科学基金面上项目2020-2022, 40万，主持，在研。

2. 福建省自然科学基金项目2018-2021, 4万，主持，在研。

3. 广东省自然科学基金项目2018-2021，10万，主持，在研。

4. 深圳市知识创新计划基础研究项目2017-2019，30万，主持，已结题。

5. williamhill官方网站主页校长基金2017-2019，31.17万，主持，已结题。

6. 福建省中青年教师教育科研项目2017-2019，1万，主持，已结题。

7. 国家自然科学基金青年基金项目2014-2016，25万，主持，已结题。

8. 中国博士后科学基金项目2013-2015，8万，主持，已结题。

9. 企业横向课题等 累计39 万。

以第一作者或通讯作者发表学术期刊与会议论文30余篇，其中包括在Acta Materialia, Materials & Design, ACS Applied Materials & Interfaces等国际著名期刊。Scripta Materialia, Materials & Design, Journal of Vacuum Science & Technology A, Industrial & Engineering Chemistry Research, Journal of Electronic Materials, Journal of Materials Science: Materials in Electronics杂志审稿专家。申请国家发明专利10余项，其中已授权国家发明专利6项。

（1）SCI论文

1.Yuxi Yu*, Yixin Liu, Zhihao Zhang*, Fabrication of high fracture-strength and gas-tightness PDC films via PIP process for pressure sensor application, Journal of the American Ceramic Society, 2020, https://doi.org/10.1111/jace.17063.

2.Z.H. Zhang*, C.W. Wei, J.J. Han*, H.J. Cao, H.T. Chen*, M.Y. Li, Growth evolution and formation mechanism of η′-Cu6Sn5 whiskers on η-Cu6Sn5 intermetallics during room-temperature ageing, Acta Materialia, 2020, 183, 340-349.

3.Zhihao Zhang*, Cunwei Wei, Huijun Cao*, Ye Zhang*, Damage mechanism of Cu6Sn5 intermetallics due to cyclic polymorphic transitions, Materials, 2019, 12, 4127.

4.Z.H. Zhang*, C.W. Wei, H.J. Cao*, J.J. Han, Y. Zhang, Structure-induced metastable phase transformation in Cu6Sn5 intermetallics, Materials Letters, 2019, 249, 124-127.

5.Chunjin Hang, Junjian He, Zhihao Zhang*, Hongtao Chen*, Mingyu Li, Low temperature bonding by infiltrating Sn3.5Ag solder into porous Ag sheet for high temperature die attachment in power device packaging, Scientific Reports, 2018, 8, 17422.

6.Y. Xiao*, Z.H. Zhang*, M. Yang, H.F. Yang, M.L. Li*, Y. Cao, The effect of NaOH on room-temperature sintering of Ag nanoparticles for high-performance flexible electronic application, Materials Letters, 2018, 222, 16-20.

7.Z.H. Zhang*, H.J. Cao. H.T. Chen, Formation mechanism of a cathodic serrated interface and voids under high current density, Materials Letters, 2018, 211, 191-194.

8.Zhihao Zhang*, Huijun Cao, Yong Xiao, Yong Cao, Mingyu Li, and Yuxi Yu. Electromigration-induced growth mode transition of anodic Cu6Sn5 grains in Cu/SnAg3.0Cu0.5/Cu lap-type interconnects. Journal of Alloys and Compounds, 2017, 703, 1-9.

9.Zhihao Zhang*, Huijun Cao, Haifeng Yang, Yong Xiao, Mingyu Li, Yuxi Yu, and Shun Yao. Microstructural Evolution and Migration Mechanism Study in a Eutectic Sn-37Pb Lap Joint Under High Current Density. Journal of Electronic Materials, 2017, 46, 5028-5038.

10.Z.H. Zhang*, M.Y. Li*, Z.Q. Liu and S.H. Yang. Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)Cu and liquid-Sn0.7Cu/(001)Cu joint interfaces. Acta Materialia, 2016, 104, 1-8.

11.Zhihao Zhang*, Huijun Cao, Mingyu Li*, Yuxi Yu, Haifeng Yang and Shihua Yang. Three-dimensional placement rules of Cu6Sn5 textures formed on the (111)Cu and (001)Cu surfaces using electron backscattered diffraction. Materials & Design, 2016, 94, 280-285.

12.Z.H. Zhang*, H.J. Cao, H.F. Yang, M.Y. Li* and Y.X. Yu. Hexagonal-Rod Growth Mechanism and Kinetics of the Primary Cu6Sn5 Phase in Liquid Sn-Based Solder. Journal of Electronic Materials, 2016, 45, 5985-5995.

13.M.Y. Li*, H.F. Yang, Z.H. Zhang*, J.H. Gu and S.H. Yang. Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention. Scientific Reports, 2016, 6, 27522.

14.Mingyu Li*, Yong Xiao, Zhihao Zhang* and Jie Yu. Bimodal Sintered Silver Nanoparticle Paste with Ultrahigh Thermal Conductivity and Shear Strength for High Temperature Thermal Interface Material Applications. ACS Applied Materials & Interfaces, 2015, 7, 9157-9168.

15.Z.H. Zhang, H.J. Cao, M.Y. Li*, Y. Wang and Z.Q. Liu*. Cathodic peeling damage of Cu6Sn5 phase in Cu/SnAg3.0Cu0.5/Cu bridge interconnections under current stressing. Journal of Applied Physics, 2014, 116, 054909.

16.Zhihao Zhang, Mingyu Li* and Chunqing Wang*. Fabrication of Cu6Sn5 single-crystal layer for under-bump metallization in flip-chip packaging. Intermetallics, 2013, 42, 52-55.

17.M.Y. Li*, Z.H. Zhang and J.M. Kim*. Polymorphic transformation mechanism of η and η' in single crystalline Cu6Sn5. Applied Physics Letters, 2011, 98, 201901.

（2）国家发明专利

1.一种单向性Cu6Sn5纳米棒及其制备方法、应用 CN201810163146.6公开

2.一种铜六锡五全IMC互连结构的制造方法 CN201710240096.2授权。

3.一种高温封装用Sn/Cu/Sn冷压预制片的制备方法CN201610822937.6授权。

4.一种快速评价Sn基钎料Sn晶须生长倾向的方法CN201610424229.7公开。

5.一种高温封装用Cu6Sn5基单晶无铅焊点的定向互连方法 CN201510409778.2授权。

6.一种三维封装互连焊点下Cu6Sn5相单晶扩散阻挡层的合成方法 CN201510390429.0授权。

7.一种Cu6Sn5金属间化合物单晶种籽的制备方法 CN201510317525.2公开

8.一种复合纳米银粒子导电墨水及其制备方法和印刷应用 CN201510234542.X公开

9.一种用作热界面材料的双峰分布纳米银膏及其制备方法 CN201510043602.X 授权

10.一种单一取向Cu6Sn5金属间化合物微互连焊点结构的制备及应用方法 CN201310648319 授权

11.加载贴片天线的SiBCN无线无源温度传感器及其制备CN201810009029.4公开

12.加载贴片天线的SiCN无线无源温度传感器及制备方法CN201810009046.8公开

13.加载贴片天线的SiAlCN无线无源温度传感器及制备CN201810009172.3公开